JCET Announces Major Shanghai Investment to Bolster Advanced Packaging Capacity
In a significant move to expand its footprint in the competitive semiconductor packaging sector, JCET has unveiled plans for a new high-end advanced packaging and testing facility. The company intends to establish a controlling subsidiary to carry out the project within Shanghai's Lingang New Area, with total investment reaching approximately 7.8 billion RMB (around $1.1 billion). The registered capital for the venture is expected to be 4 billion RMB.
Two-Phase Construction Targets 2028 Operational Start
The project will be executed in two distinct phases. The initial phase, slated for completion in the second half of 2028, focuses on core infrastructure including plant construction, interior fitting, and substantial investment in production equipment. This phased approach provides JCET with strategic flexibility to align later-stage investments with evolving market demands and technological developments.
Strategic Rationale: Securing Leadership in a Critical Segment
The company states that this substantial capital outlay is strategically aimed at accelerating its capacity deployment in high-end advanced packaging. Demand for sophisticated packaging solutions—such as wafer-level packaging, system-in-package (SiP), and 2.5D/3D integration—is surging, driven by applications in AI, high-performance computing, and 5G. Establishing a new facility in Shanghai, a central hub for China's semiconductor ecosystem, positions JCET closer to key customers and partners, enhancing its ability to integrate supply chain resources.
Industry analysts view this investment as a decisive step for JCET to strengthen its service capabilities for global clients requiring cutting-edge packaging, solidifying its competitive stance for the next generation of chip technologies.