TSMC's Photonic Chip Capacity Set to Skyrocket: 25,000 Wafers Monthly by 2028, Fueled by AI and Data Center Boom
TSMC is rapidly scaling its Photonic Integrated Circuit (PIC) production capacity, according to industry forecasts. Monthly output is projected to surge to 10,000 wafers by Q2 2026 and reach at least 25,000 wafers by 2028. This expansion could boost annual chip output from around 4 million to nearly 200 million units, driven by soaring demand from AI and high-speed data transmission.
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