SK Hynix Ramps Up Outsourcing: DDR5/DRAM Packaging Orders Shift to WINPAC, Boosting Production Capacity
SK Hynix is expanding its outsourcing of memory semiconductor packaging. After A-PROTECH, it has resumed cooperation with WINPAC after four years, outsourcing part of its DDR4/DDR5 DRAM packaging orders. WINPAC's production lines are now in mass production, with monthly capacity increased from 44 million to 50 million units for high-performance products.
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