Shanghai's Lingang Chip Hub Breaks Ground: Multi-Billion Dollar Fab Targets 55-28nm Nodes for 2027 Production
Shanghai's Lingang New Area has officially launched its major integrated circuit manufacturing project. The first phase, with vast investment and floor area, will focus on 55nm to 28nm process R&D and production. Construction starts Q3 2026, targeting operational status by end-2027 to provide global foundry services.
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